Through-Silicon Vias for 3D Integration

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  1. TECHNICAL FIELD

Besides the challenging photolithographic, etching, and deposition processes, performance is influenced by geometry e.

TECHNICAL FIELD

Based on several geometries, a transmission model is developed that may be used to describe waveguiding and non-waveguiding optical TSV structures. System-level measurements complete the results shown in this chapter. Due to the low transmission distances, even non-waveguiding schemes show low loss.

Through Silicon Vias for 3D Integration Electronics

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Kim, J. Kang, J.


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Kim, Simple and low cost fabrication of thermally stable polymeric multimode waveguides using a UV-curable epoxy. Lott, A. Payusov, S.